Failure Analysis Engineer – Electronics & AI Server Hardware

Our client is seeking a Failure Analysis Engineer investigates and identifies root causes of failures in electronic assemblies, components, and systems used in high‑performance computing, server, and AI hardware products. This role supports product reliability, manufacturing yield improvement, and customer satisfaction through structured analysis, cross‑functional collaboration, and corrective action implementation.

Onsite | No Visa Sponsorship | No Relocation Assistance

Responsibilities:

Failure Analysis & Root Cause Investigation

• Identify failure modes, determine root causes, and document contributing factors.
• Correlate failures with design, process, and material data to support engineering improvements.
• Perform electrical, mechanical, and thermal failure analysis on production defects, field returns, and reliability test samples.
• Use diagnostic tools such as oscilloscopes, digital multimeters, logic analyzers, X‑ray, SEM/EDS, FIB, decapsulation, and cross‑sectioning.

Data Collection & Reporting

• Track recurring failure modes, reliability trends, MTBF, and failure rates.
• Present analysis results to engineering, manufacturing, quality, and customer teams.
• Prepare detailed FA reports including findings, corrective actions, and risk assessments.

Cross‑Functional Collaboration

• Support component validation and incoming inspection activities.
• Coordinate with customer support teams on field failure investigations.
• Partner with manufacturing, quality, R&D, and supplier quality teams to drive CAPA.

Process & Product Improvement

• Contribute to SOPs, process control documentation, and reliability standards.
• Participate in Design for Manufacturability (DFM) and Design for Reliability (DfR) reviews.
• Recommend design or process changes to reduce defect rates and improve reliability.

Compliance & Safety

• Maintain lab equipment calibration and safe operating practices.
• Ensure FA activities comply with ESD, ISO, RoHS, and REACH requirements.

Qualifications (Must-Haves)

• Strong analytical and problem‑solving skills.
• Ability to interpret schematics, PCB layouts, and BOMs.
• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• Proficiency with FA tools: oscilloscope, DMM, logic analyzer, X‑ray, SEM, FIB, decapsulation, cross‑sectioning.
• 3–5 years of experience in failure analysis or reliability engineering in electronics, semiconductor, or high‑tech manufacturing.
• Strong knowledge of SMT manufacturing, solder joint analysis, IPC standards, and reliability testing (HALT, HASS, thermal cycling, vibration)

Preferred Skills:

• Experience supporting DFM and DfR activities.
• Experience with AI servers, GPU boards, or data‑center hardware.
• Experience with Python, JMP, Minitab, or advanced data analysis tools.
• Master's degree in Reliability Engineering, Failure Analysis, or Quality Engineering.

Working Conditions:

• Flexibility to support urgent FA cases and project deadlines.
• Occasional domestic/international travel to suppliers or customer sites.
• On‑site electronics lab environment (ESD‑safe areas, microscopes, soldering stations)