Packaging Module Development Engineer
INTEL
Phoenix, Maricopa County$230,905 - $230,905 est.Full-timePosted 14h ago
Job Description The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.As a Packaging Module Development Engineer, you will.•Contribute to the advancement of te…
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